Program at a Glance

KST	EEST Athens	CEST (CET) Paris	UTC	EDT New York	PDT Los Angeles

Click the session code to see detailed schedules.
Last update : November 7, 2022 (KST)

Nov. 13 (Sun.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Sidney Room, 2F)	Room E (Grand Ballroom 3, 2F)	Room F (Sicily Room, 1F)	2F Lobby & Miami Room, 2F
	18:00~20:00	Welcome Reception (Sicily Room, 1F)

Nov. 14 (Mon.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Sidney Room, 2F)	Room E (Grand Ballroom 3, 2F)	Room F (Sicily Room, 1F)	2F Lobby & Miami Room, 2F
	10:00~10:45	Plenary Session I (Capri Room, 2F) "Technology Inflection Points in Logic Semiconductor Technology : What is Next?" Fellow, Dong-Won Kim (Samsung Electronics Co., Ltd., Korea)						Exhibition
	10:45~11:00	Coffee Break (2F Lobby)
	11:00~11:30	Opening Ceremony (Grand Ballroom 1, 2, 3, 2F)
	11:30~13:00	Lunch
	13:00~14:45	MA1	MB1	MC1	MD1	ME1	MF1
		Nanoscale Thin Film Deposition Ⅰ	Advanced CMP Process & Scratchless Wet Ceria	High Aspect Feature Etching	EUV Imaging	3D PackageⅠ	Smart and Intelligent MI
	14:45~15:00	Coffee Break (2F Lobby)
	15:00~16:55	MA2	MB2	MC2	MD2	ME2	MF2
		Nanoscale Thin Film Deposition Ⅱ	Novel CMP Slurries	Etch Technology Trend	EUV Resist Ⅰ	Packaging Material/Analysis	Analysis Ⅰ
	16:55~17:10	Coffee Break (2F Lobby)
	17:10~18:00	Poster Session I (Grand Ballroom 4, 2F)

Nov. 15 (Tue.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Sidney Room, 2F)	Room E (Grand Ballroom 3, 2F)	Room F (Sicily Room, 1F)	2F Lobby & Miami Room, 2F
	09:30~11:05	TA1	TB1	TC1	TD1	TE1	TF1	Exhibition
		Nanoscale Thin Film Deposition Ⅲ	Advanced CMP Process & CMP Slurry	Plasma Etch Measurements & Diagnostics	EUV Resist Ⅱ and Alternative Lithography	Equipment, Process, Metrology	Analysis Ⅱ
	11:05~11:20	Coffee Break (2F Lobby)
	11:20~12:35	TA2	TB2	TC2	TD2	TE2	TF2
		Nanoscale Thin Film Deposition Ⅳ	Advanced CMP Process Ⅰ	Plasma Etch Measurements & Diagnostics II	EUV Mask, Pellicle, Inspection Ⅰ	3D Package Ⅱ	Analysis Ⅲ
	12:35~13:30	Lunch
	13:30~14:15	Plenary Session II (Capri Room, 2F) "Opportunities and Challenges of Emerging Memory In The Era of All About Data" Head of RTC, Myung-Hee Na(SK hynix, Korea)
	14:15~14:30	Coffee Break (2F Lobby)
	14:30~16:15	TA3	TB3	TC3	TD3	TE3	TF3
		Nanoscale Thin Film Deposition Ⅴ	CMP Cleaning Evolution	Metal Etching	EUV Mask, Pellicle, Inspection Ⅱ	3D Integration/Process	Analysis Ⅳ
	16:15~18:30	Break
	18:30~20:30	Banquet (Grand Ballroom, 2F)

Nov. 16 (Wed.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Sidney Room, 2F)	Room E (Grand Ballroom 3, 2F)	Room F (Sicily Room, 1F)	2F Lobby & Miami Room, 2F
	09:30~10:30	Special Session (Capri Room, 2F) "Memory Technology 2022 and Beyond" Dr. Jeongdong Choe(Techlnsights, Canada)						Exhibition
	10:30~10:45	Coffee Break (2F Lobby)
	10:45~12:15	WA1	WB1	WC1	WD1	WE1	WF1
		Nanoscale Thin Film Deposition Ⅵ	Material Issues in Semiconductor Fabrication	Atomic Layer Etching	EUV Mask, Pellicle, Resist Ⅲ	Package Material/Unit Process	Diagnosis for Plasma Process
	12:15~13:30	Lunch
	13:30~14:55	WA2	WB2	WC2	WD2	WE2	WF2
		Nanoscale Thin Film Deposition Ⅶ	Advanced CMP Process Ⅱ	Atomic Scale Etch Processing		Semiconductor Devices and Materials
	14:55~15:10	Coffee Break (2F Lobby)
	15:10~16:30	WA3	WB3	WC3	Poster Session II (Grand Ballroom 4, 2F)
		Nanoscale Thin Film Deposition Ⅷ	Advanced CMP Related Materials	Plasma Etch Simulation
	16:30~16:45	Coffee Break (2F Lobby)
	16:45~17:00	Closing Ceremony (Best Paper Award Ceremony & Lucky Draw) (Capri Room, 2F)